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academic activities (teaching, PhD students supervision) under FST-ECE. The Shanghai Ranking of “Electrical and Electronic Engineering” of UM is 51-75. The Institute of Microelectronics (IME) invites
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. The department offers 24 graduate MS, PhD, and certificate programs, as well as undergraduate majors in mechanical engineering (ME) and industrial engineering (IE) including combined majors with physics, business
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. · Advanced Materials, Nanoelectronics, and Emerging Devices – 2D materials, spintronics, MEMS/NEMS, and flexible electronics. The successful candidate will have the opportunity to build upon existing
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Researcher Profile First Stage Researcher (R1) Positions PhD Positions Application Deadline 12 Mar 2026 - 23:59 (Europe/London) Country United Kingdom Type of Contract Temporary Job Status Full-time Hours Per
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, imaging, bio-MEMS, and nanomedicine, this field is committed to developing advanced biomedical devices, systems, and solutions for the benefit of society. Discipline, including, but not limited
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National Aeronautics and Space Administration (NASA) | Pasadena, California | United States | 3 months ago
. Description: This opportunity involves research and development activities in the following technology areas: 1. Chip-scale stable laser systems using MEMS and nanophotonic technologies including but not
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Qualifications Education PhD in Physics, Material Sciences or related field. Experience and Technical Skills Strong background in magnetism and spintronic devices; Capacity to design and automate data acquisition
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Duke University, Mechanical Engineering and Materials Science Position ID: Duke-MEMS-PDCURTAROLO [#31553] Position Title: Position Type: Postdoctoral Position Location: Durham, North Carolina 27701
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on the project can be found here: https://hecustom.eu/ Total shoulder replacement (TSR) is increasingly offered to younger, more active patients, yet implant loosening and migration remain leading
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special interest in candidates with backgrounds in Quantum Computing/Communications/Networking/Signal Processing, Advanced Packaging, Artificial Intelligence, RF Electronics, and MEMS. The faculty members