90 phd-in-power-electronics Fellowship research jobs at Hong Kong Polytechnic University
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Department of Electrical and Electronic Engineering Postdoctoral Fellow / Research Assistant (Ref. 250520001) (1) Postdoctoral Fellow (2) Research Assistant [Appointment period: each for
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to contact Prof. Xiao Zhang at telephone number 2766 6649 or via email at xiao1.zhang@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered
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are invited to contact Prof. Jinzhi Bu at telephone number 2766 7415 or via email at jinzhi.bu@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be
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machine learning methods, particularly large language models (LLMs), to marketing research. Applicants are invited to contact Prof. Edward Lai at telephone number 2766 7141 or via email at edward-yh.lai
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for the Research Assistant post should have an honours degree or an equivalent qualification. Applicants are invited to contact Prof. John Xin at telephone number 2766 6474 or via email at john.xin@polyu.edu.hk
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number 2766 5856 or via email at cheuk-ming.mak@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is
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. Applicants are invited to contact Prof. Yi-teng Shih at telephone no. 2766 5456 or via email at yi-teng.shih@polyu.edu.hk for further information. Conditions of Service The remuneration rate is HK$394 per
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. Sitman at telephone number 3400 2473 or via email at xw.wen@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date
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be given to those with background in laser, ceramic materials and CAE. Applicants are invited to contact Prof. Wen X. Sitman at telephone number 3400 2473 or via email at xw.wen@polyu.edu.hk
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. Qing Li at telephone number 2766 7252 or via email qing-prof.li@polyu.edu.hk for further information. Conditions of Service For full-time appointments, a highly competitive remuneration package will be