30 phd-computational-intelligence Fellowship positions at Hong Kong Polytechnic University
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the project leader, the Head of Unit or their delegates. Qualifications Applicants for the Research Fellow post should have a PhD degree in Data Science, Computational Social Science, AI, Biomedical Engineering
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project - “Enhancing older adults' healthy dining with explainable AI menu recommendations”. Qualifications Applicants should have: (a) a PhD degree in Computer Science and must have no more than five
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the project leader in the research project - “Individual differences, artificial intelligence, and second language acquisition”. The primary focus of the project is to examine the interface between individual
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”. Qualifications For the post of Postdoctoral Fellow, applicants should have a PhD in Civil / Structural Engineering or a related field and must have no more than five years of post-qualification experience
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project - “Large vision model for spatial intelligence of autonomous systems”. Qualifications Applicants should have: (a) a doctoral degree plus at least six years of postdoctoral research experience
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leader in the research project - “The Hong Kong Polytechnic University – Yunji Technology Hotel Digital Intelligence Joint Innovation Lab”. He/She will be required to: (a) support the implementation of
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Engineering, Materials Engineering, Artificial Intelligence (AI) or other related disciplines or an equivalent qualification and must have no more than five years of post-qualification experience at the time of
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doctoral degree in Electronic Engineering, Computer Science, Artificial Intelligence or a related discipline plus at least three years of postdoctoral research experience or an equivalent qualification and
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twelve months] Duties The appointees will assist the project leader in the research project - “A multimodal intelligence-enabled strategy learning approach for cognitive human-robot collaborative assembly
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months] Duties The appointees will assist the project leader in the research project - “Development of intelligent ultra-precision air-bearing hydrostatic spindle for grinding semiconductor wafer