12 molecular-modeling-or-molecular-dynamic-simulation Fellowship positions at Johns Hopkins University
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systems is a strong asset; an interest in learning about these domains is essential. Proficiency in designing and implementing computational models to simulate normative behaviors and group dynamics. Strong
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and modeling of properties and spectra of PFAS chemicals with the goals of improving detection of PFAS compounds, replacing PFAS in plasma etching processes, or identifying solid adsorbent additives
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simulation models of existing test structure geometries to enable simulation and optimization for specific PIC platforms Investigate methods to optimize test structure designs for more robust determination of
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-earthquake assessment and decision-making for structural engineers. - Conduct nonlinear dynamic analyses and consequence modeling across a suite of steel building archetypes to demonstrate the real
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models, frameworks, and methods to confront complexity underlying persistent societal challenges affecting the well-being of people and the planet. This position represents a unique opportunity to
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on innovative design for legal and regulatory systems for AI and other complex global technologies; computational models of human normative systems; and working with machine learning researchers to build ML
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to 100 GHz, using custom and commercial test fixtures. Develop and simulate computational models of material-loaded microelectronic devices to quantify electric, acoustic, and piezoelectric fields for a
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statement in support of your application CV Copy of Graduate Transcript(s) Writing Sample Two Letters of Reference For more information on the Berman-Oxford GLIDE Post-doctoral Fellowship Program, please
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work that underpins the scientific research of the collaboration. Research Title: Process Modeling using Physically Informed Machine Learning The work will entail: § Designing and training physics
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: The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a researcher with knowledge of reliability testing and modeling for advanced semiconductor packaging and extensive