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thermal conductivity b) Development of hBN thermal interface material that combines a high degree of compressibility and recovery c) Modeling, simulation and characterization of phonon transfer across
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postdoctoral scientists to work on building the next generation of quantum processors based on superconducting circuits. To achieve this ambitiuous goal we have a variety of projects related to: Simulation
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is close. Our cohesive campuses make it easy to meet, work together and exchange knowledge, which promotes a dynamic and open culture. The ongoing societal transformation and large green investments in
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