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that are potentially present in the EoL scrap stream through single and multiple deliberate additions. To use advanced characterisation techniques to investigate features in the microstructure that are introduced by
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Institute of Microstructure Physics Halle (MPI-MSP ), Nanoelectronic Materials Laboratory gGmbH (NaMLab ) in Dresden, Ruhr-Universität Bochum (RUB ). For the initial funding phase (April 2025 – December 2028
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( FZJ ), Max Planck Institute of Microstructure Physics Halle ( MPI-MSP ), Nanoelectronic Materials Laboratory gGmbH ( NaMLab ) in Dresden, Ruhr-Universität Bochum ( RUB ). For the initial funding
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for accelerating characterisation and “state of health” monitoring. Testing of solid oxide cells under different operation conditions and microstructural characterisation after tests to identify degradation
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on their suitability during reconnaissance field work. The research will involve a combination of several potential methods, including detailed field work, petrography and microstructural characterization, scanning
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framework and execution of projects > Understanding of financial products, market dynamics, and microstructure > Low-level computer languages like C++ or Python, Java, etc.; awareness of strength in
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framework and execution of projects > Understanding of financial products, market dynamics, and microstructure > Low-level computer languages like C++ or Python, Java, etc.; awareness of strength in
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materials, to aid design of novel more energy-efficient processing routes. The development of these digital twins requires reliable and predictive models for microstructure formation during steel processing
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the material in the facility available at Cranfield’s high temperature corrosion laboratory. A detailed analytical phase. for better understanding of the microstructure, requires working on the advanced
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mechanics, corrosion, multiphysics modeling and microstructural characterisation. The candidate must be enthusiastic about working as part of a team and collaborating with national research facilities and