11 master-degree-study-in-mechatronics Postdoctoral positions at University of Twente
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on the development of a CNT–silica hybrid filler through the pre-reaction of functionalized CNTs with silica prior to compounding with rubber. The study also investigates the interaction between functionalized CNTs
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work. A CV including English proficiency level, nationality, visa requirements, date of birth, experience overview, and publication list. Contact information for at least three academic references. A
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implementing real-time algorithms for tracking muscle fascicle kinematics concurrently from the tibialis anterior and soleus muscles using B-mode and RF ultrasound signals. Conducting experimental studies with
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, spinal cord injury etc) through real-time neural control of wearable robotic exoskeletons. You will be developing next-generation (low and high-level) control algorithms for wearable exoskeletons that use
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-master design program being part of the program Business Information Technology. For more information on the BIT EngD program, see https://www.utwente.nl/en/education/tgs/interested-in/engd/programmes
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contribute to smart grids that make energy networks more efficient, mathematical models that assist medical doctors, schedules that make hospitals more efficient and numerical schemes to study multiscale fluid
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aimed to bridge fundamental studies with application-oriented ‘proof-of-principle’ device developments. Most of the experimental research concentrates around thin film samples, which are fabricated in
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2,900 Bachelor's and Master's students, 550 employees and 150 PhD candidates. Our educational and research programmes are closely connected with UT research institutes Mesa+ Institute, TechMed Center and
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specific interest and motivation, a detailed CV, and a copy of your doctoral degree. An interview and a scientific presentation will be part of the selection procedure. For more information about the
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of the imaging system will require innovative solutions to adapt the wafer surface position on the nm level! In order to have the wafer surface fully inside the depth of focus, height corrections of the order of