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ability. Excellent communication skills: both oral and written. Knowledge of clean room equipment operation for thin-film deposition, diffusion, oxidation, lithography and etching, including wet and dry
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of magnetic tunnel junctions, including PVD deposition systems, Ion Milling, Direct Write Laser Lithography, Mask Aligners, E-beam systems, CVD deposition tools, RIE tools, SEM inspection tools and metrology
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National Aeronautics and Space Administration (NASA) | Pasadena, California | United States | about 1 month ago
at this time, unless they are Legal Permanent Residents of the United States. A complete list of Designated Countries can be found at: https://www.nasa.gov/oiir/export-control . Eligibility is currently open to
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The revolutionary introduction of EUV lithography was the culmination of several decades of collaborative work between industry and science – a Project Apollo of the digital age. The short, 13.5-nm EUV wavelength
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of Prof. Tomasz Smoleński at the Department of Physics, University of Basel, Switzerland (https://smolenski-lab.com ), is looking for a highly-motivated and self-driven PhD candidate. The group utilizes
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process development across thin-film, etch, lithography, and packaging tools. Establish repair and preventative maintenance priorities and ensure minimal downtime. Coordinate with campus facilities, safety
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Comsol Multiphysics, thin-film deposition, photolithography and e-beam lithography, reactive ion etching and SEM Prior practical experience with optical waveguides Experience with spectroscopy, either
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core capabilities include plasma processing, electron beam lithography, photolithography, thin film deposition, and metrology. The postholder will provide essential technical support to ensure the smooth
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website for details: https://www.ifsw.uni-stuttgart.de/en/institute/vacancies Summary of titles and host institutions for the 15 PhD positions: FELLOW 1 (IFSW, Stuttgart, Germany): Design and
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that have been previously attacked using more numerical approaches. For example, some members of the DAG group are currently working on metrology and inverse lithography problems with ASML using discrete