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National Aeronautics and Space Administration (NASA) | Pasadena, California | United States | about 5 hours ago
from Designated Countries will not be accepted at this time, unless they are Legal Permanent Residents of the United States. A complete list of Designated Countries can be found at: https://www.nasa.gov
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, orbital Rashba-Edelstein length, decoherence length) in these multilayers and at their interfaces. We will design on 200 nm or less magnetic memory elements made by e-beam lithography to achieve the proof
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experience with nanofabrication processing (electron-beam lithography, maskless lithography, electron beam evaporation, dry etching, atomic layer deposition) • Background towards microsystems technology and
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laboratory-scale fabrication processes required for state-of-the-art fabrication, including thin film deposition, electron microscopy, electron beam lithography, nanoimprint lithography, and reactive ion
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comprehensive training in IEMN's cleanroom facilities. The cleanroom work will rely on process modules including molecular beam epitaxy (MBE), dielectric deposition (PECVD and/or sputtering), optical lithography
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la lithographie et les procédés de modification de surface. Afin d'illustrer les possibilités facilitées par ces développements instrumentaux, le (la) candidat(e) sera amené(e) à effectuer des études
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part, des micro-électrodes seront fabriquées (via lithographie à faisceau d'électrons en salle blanche) pour électropolymériser les monomères dans des conditions douces et à petite échelle sur des puces
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, intaglio, lithography, screen-printing, and/or hybrid and digital methods. Knowledge of history, contemporary practices, and critical frameworks relevant to studio art instruction. Knowledge of studio safety
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interest in working in a cross-disciplinary environment: Micro- and nanofabrication specialist – expertise in clean-room processing, lithography, etching, microfluidic integration, and planar waveguide
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Master Thesis in Physics or Materials Science: Remanent phase shifter based on memristive technology
techniques, including pulsed laser deposition (PLD), sputter deposition, electron-beam evaporation, optical lithography, and ion-beam etching. Characterization of individual layers using atomic force