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(lasers, optical spectrum analyzers, RF instruments, probe stations). Develop and execute measurement procedures, data acquisition scripts, and result analysis. For Packaging and Assembly: Development and
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passivating contacts (poly-Si/SiOx, doped a-Si:H, TCOs) Familiarity with device simulation (Sentaurus TCAD, Quokka, AFORS-HET) Experience with laser processes (LECO, slicing, etc.) Knowledge of surface
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for lighting and displays (LEDs), data storage (laser diodes), microwave applications (RF HEMT transistors), and new devices (transistors, diodes) are being developed to convert electrical energy. To reduce the
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, and Merit-Based Recruitment Policy, the content of which can be accessed at: https://rekrutacja-i-rozwoj.bsp.uw.edu.pl/polityka-rekrutacji Information about the Internal Reporting Procedure
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will close at 12:01 a.m. CT on the specified Closing Date (if designated). If you close the browser or exit your application prior to submitting, the application process will be saved as a draft. You
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will close at 12:01 a.m. CT on the specified Closing Date (if designated). If you close the browser or exit your application prior to submitting, the application process will be saved as a draft. You
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‑Ionizing Radiation Safety Program covering lasers, MRI fields, RF sources, UV systems, and other electromagnetic hazards. Reviews and provides technical guidance on facility design, shielding, and
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16, and any formalities established therein must be fulfilled before the hiring process. Requirement 2: Be enrolled in a Doctoral Program in Civil Engineering. Requirement 3: Have proven experience in
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experience with lasers, LEDS, optical system hardware, clean room fabrication, electronic circuit design, optical engineering, signal processing, and data analysis. Visit our website for more information about
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operating microscope image capture systems, Alexos (An-vision) and Compact Intuitiv (AMO) cataract surgery units, Endo Optiks E2 endolaser, Iridex diode laser with transpupillary headset and microscope