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University of California, San Francisco | San Francisco, California | United States | about 2 months ago
procedures. Perform routine clinical tasks (e.g., height, weight, pain screening, chief complaint documentation). Act as chaperone and assist in complex procedures (e.g., laser therapy, TRUS, IRC) with
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improvements in processes, design, procedures, and operating equipment to minimize the hazard potential, with a focus on rodent infiltration and mitigation. May lead a team (consultants, temporary labor, etc
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materials and process, with at least two of the following: metal fabrication, foundry, wood construction, clay modeling, plaster casting, and CNC router and laser cutter technology, is required for those
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guidance for amniocentesis. Interest in further training in prenatal fetal surgery (Laser therapy, MMC repair) and guidance for chorionic chronic villi sampling. Key Responsibilities 85% - ULTRASOUND
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surgery (Laser therapy, MMC repair) and guidance for chorionic chronic villi sampling. Key Responsibilities 85% - ULTRASOUND SCANNING 10% - GENERAL DEPARTMENT FUNCTIONS 5% - OPERATION OF ULTRASOUND
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, sustainable production, additive manufacturing and laser technology. Our scientific staff work in these fields in research, teaching and industry transfer with the aim of obtaining a doctorate. Requirements
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studies the above listed modalities to advance the goals of the principal investigator’s research projects. This includes performing experiments, processing and analyzing data, compiling results and
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perform desk-based computer tasks. Occasionally use a telephone, write by hand. Rarely kneel, crawl, climb ladders, reach/work above shoulder, twist/bend/stoop/squat, grasp lightly/fine manipulation, grasp
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the internal application process. Welcome to The Ohio State University's career site. We invite you to apply to positions of interest. In order to ensure your application is complete, you must complete
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. Attention to detail and ability to troubleshoot experiments are essential attributes. Electromechanical prototyping abilities (including computer-aided design, 3D printing, laser cutting, and PCB design) and