Sort by
Refine Your Search
-
Listed
-
Category
-
Country
- United States
- United Kingdom
- Portugal
- Spain
- Sweden
- France
- Germany
- Netherlands
- Italy
- Denmark
- Canada
- Belgium
- China
- Hong Kong
- Singapore
- Switzerland
- Austria
- Ireland
- Japan
- Norway
- United Arab Emirates
- Australia
- Mexico
- Saudi Arabia
- Armenia
- Estonia
- Finland
- Greece
- Israel
- Morocco
- Poland
- Vietnam
- 22 more »
- « less
-
Program
-
Field
-
PICs@ICFO Strategic Inititative: Innovation Manager – Photonics Integrated Circuits (PICs) Portfolio
Photonic Integrated Circuits (PICs) in Europe. As part of our expanding efforts, we are reinforcing our leadership in the full PIC value chain—including design, fabrication, advanced packaging, testing, and
-
tunability and high-order dynamics to realize dendrite-inspired functional circuits. These circuits will subsequently be integrated as core computational modules within unconventional computing architectures
-
of Engineering Position Headcount 1 Position Title Student Faculty Assistant - CENG 465 Integrated Circuit Design Academic Year Spring 2026 Term or Semester Spring Is this Role for an Undergrad or Grad Student
-
Photonic Integrated Circuits (PICs) in Europe. As part of our expanding efforts, we are reinforcing our leadership in the full PIC value chain—including design, fabrication, advanced packaging, testing, and
-
subsystems; and the ability to simulate and design photonic integrated circuits and RF PCBs. Candidates must also have proven expertise in the characterisation of advanced photonic integrated circuits and high
-
Integrated quantum photonics using semiconductor quantum dots School of Mathematical and Physical Sciences PhD Research Project Self Funded Prof M Fox, Prof Luke Wilson Application Deadline: 30
-
Storage, Control and Robotics, Microelectronics and Semiconductor Devices, Bioelectronics and Quantum Technologies, Integrated Circuit Design, Intelligent Computing, Signal Processing and Information
-
/wireless/wireline systems, imagers, MEMS, medical/display circuits, power management, 2.5D/3D integrated circuits, and secure computing designs. Successful applicants will be expected to develop
-
perspective with the circuit perspective. We design integrated circuits, ICs, (chips) in advanced nanometer silicon (foremost CMOS) technologies, e.g. radio-frequency front-ends, data converters, digital signal
-
the Mechanics of Composites for Energy and Mobility Lab. (MCEM, https://composites.kaust.edu.sa ). Field of study We are seeking a highly motivated Research Engineer to join our research lab and contribute