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neuronal types shapes sensory coding and circuit computation, with a strong emphasis on neocortical cell diversity and synaptic properties. We integrate detailed biophysical work with in vivo circuit-level
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). -- - Design of CMOS oscillators in the sub-terahertz band. - Design and testing of analogue CMOS circuits. - Validation, verification and testing of chiplets for heterogeneous integration. - RF (radio frequency
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Photonic Integrated Circuits (PICs) in Europe. As part of our expanding efforts, we are reinforcing our leadership in the full PIC value chain—including design, fabrication, advanced packaging, testing, and
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PICs@ICFO Strategic Inititative: Innovation Manager – Photonics Integrated Circuits (PICs) Portfolio
Photonic Integrated Circuits (PICs) in Europe. As part of our expanding efforts, we are reinforcing our leadership in the full PIC value chain—including design, fabrication, advanced packaging, testing, and
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tunability and high-order dynamics to realize dendrite-inspired functional circuits. These circuits will subsequently be integrated as core computational modules within unconventional computing architectures
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neuroscience. Applicants can be from any area of molecular, cellular, circuits, systems, cognitive, or computational and theoretical neuroscience. Applicants should have a proven ability to perform outstanding
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, analog and digital circuits, embedded systems, and digital systems design. We also welcome applicants whose work spans other areas, such as control systems, power electronics, integrated circuit design
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the FALL 2026 semester in one or more of the following areas: Integrated circuit (IC) design, VLSI, and semiconductor device fabrication and manufacturing. We seek applicants with strong theoretical
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-destructive, fast, and suitable techniques for qualifying integrated electronic circuits at the end of their first life cycle, in order to facilitate their reuse. 1. Study of the main aging mechanisms and their
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/wireless/wireline systems, imagers, MEMS, medical/display circuits, power management, 2.5D/3D integrated circuits, and secure computing designs. Successful applicants will be expected to develop