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work that underpins the scientific research of the collaboration. Research Title: Thermal 3D Magnetic Imaging of Advanced Semiconductor Packages The work will entail: Our multi-disciplinary team at NIST
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to accelerated laboratory aging. - Conducting in-situ environmental digital image correlation (DIC) to quantify package and assembly deformation during thermal cycling - Developing FIB/TEM/SEM
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to codify, prototype, and archetype sustainability and scalability pathways that can support nurse leaders aiming to transform US health systems at scale. The "Embedding Neighborhood Nursing in US Health
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