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career, and you feel it relevant, let us know about it in your application. If you are a candidate with a disability, we are committed to ensuring fair treatment throughout the recruitment process. We
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to symmetry breaks in the patterning process. A hybrid modelling approach integrating the dynamics of a core network while utilising a virtual template from experiments for cellular growth and division will be
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overseas candidates, starting in 2026. Successful applicants will investigate the relationships between processing, microstructure, and properties of metals through combined macro- and micro-mechanical
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process validation. The successful candidate will have opportunities to work at TPC’s facility in Hallstahammar, contributing directly to on-site trials and process enhancements. The company’s investment in
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proactively to problem solve Application Process To apply, please upload: A covering letter/supporting statement Your CV The closing date for applications is 12 noon on Tuesday 26 August 2025 Interviews will
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This PhD project will focus on the development of scalable and sustainable dielectric deposition processes tailored for WBG semiconductors, with an emphasis on interface engineering to optimise
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proactively to problem solve Application Process To apply, please upload: A covering letter/supporting statement Your CV The closing date for applications is 12 noon on Tuesday 26 August 2025
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or joining thin-wall Titanium and Nickel alloys at high temperatures. Due to the unique material behaviours of these sheets and foils (0.1 mm to 0.5 mm thick), controlling variables in the forming process is
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to remove PFAS from water sources used for drinking. Part of the planning process involves evaluating operational aspects of these treatment processes such as contact time, media type and regeneration
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of these sheets and foils (0.1 mm to 0.5 mm thick), controlling variables in the forming process is challenging. Characterising the mechanical behaviours of thin foils at elevated temperatures is crucial in