Sort by
Refine Your Search
-
Listed
-
Category
-
Country
-
Employer
-
Field
-
Fellow in IC design to design and realize high speed high efficiency analog/RF ICs. The Research Associate/Research Fellow is also expected to support teaching activities as required by the school. Key
-
on heterogeneous integration and security of chiplet-based IC systems. This role involves research and development in AI-assisted design for chiplet-oriented architectures, aiming to demonstrate secure intelligent
-
Icing Science and Engineering. About the Role With the centre the icing team undertakes a wide range of activities including research in ice adhesion, ice properties, instrumentation, as well as ice
-
within the Faculty of Engineering and Applied Sciences (FEAS) is looking to expand its internationally renowned activities with the recruitment of a full-time Research Fellow in Impact Icing Science and
-
Responsibilities: Conduct cutting-edge research to hetero-design / chiplet-based systems, with a focus on security of components and interconnects across chiplets. Focus on new IC design concepts for embedded ARM
-
cutting-edge research to hetero-design / chiplet-based systems, with a focus on security of components and interconnects across chiplets. Focus on new IC design concepts for embedded ARM and RISC-V
-
individually, make a real difference. The role The Institute for Communication Systems (ICS), home of the 6G Innovation Centre (6GIC) is looking to recruit a full-time post-doctoral Research Fellow to work
-
empowers people to achieve this aim and to collectively, and individually, make a real difference. The role The Institute for Communication Systems (ICS), home of the 6G Innovation Centre (6GIC) is looking
-
apply the Helsinki Discrete Element Model (HiDEM) to simulations of brittle-elastic fracture, calving and retreat at Kangerlussuaq Gletsjer (KG), a large outlet glacier of the Greenland Ice Sheet. Working
-
Postdoctoral Fellow. This position is available to individuals with research interests in neuromorphic computing, IC design, embedded systems, or AI. Successful candidates will hold a terminal degree in