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National Aeronautics and Space Administration (NASA) | Pasadena, California | United States | 2 days ago
. These one- to three-year fellowships are competitive and are designed to advance NASA’s missions in space science, Earth science, aeronautics, space operations, exploration systems, and astrobiology
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the construction of the new 3D-ICE system, the fabrication of the cell niche, as well as conducting and supporting related experiments. This will include focusing on in vivo studies (design and execution) and
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curious to deliver work that matters, your journey starts here! Innovation. Interdisciplinary collaboration. Complex problem solving. In Carnegie Mellon University's Department of Mechanical Engineering
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curious to deliver work that matters, your journey starts here! Innovation. Interdisciplinary collaboration. Complex problem solving. In Carnegie Mellon University’s Department of Mechanical Engineering
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structural design standards. Experience with regional climate models (e.g., NA-CORDEX) or reanalysis data (e.g., NARR). Understanding of freezing precipitation physics or atmospheric icing processes
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discipline with a focus on integrated circuit design, packaging, and EDA (electronic design automation). Solid understanding of the IC physical design flow, familiarity with commercial EDA tools (e.g., Cadence
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(IC) chips for sensing bioimpedance and ion concentration monitoring, 2) two temperature sensors for ambient and skin temperature monitoring, 3) microprocessor with Bluetooth Low Energy capability, 4
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multidisciplinary team of researchers and students and will be responsible for executing laboratory and field-based research designed by the team to address relevant research questions. The Postdoc is expected
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curious to deliver work that matters, your journey starts here! Innovation. Interdisciplinary collaboration. Complex problem solving. In Carnegie Mellon University’s Department of Mechanical Engineering
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cannot be used for this initiative. All instructions in the SF424 (R&R) Application Guide and PA-18-591 must be followed, with the following additions: Table of IC-Specific Information and Requirements