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material property database for composites. The candidate will utilize the database to develop AI models for composite discovery. The candidate will work with a multidisciplinary team to set up finite element
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computational models (e.g., Convection-Diffusion Equations, Finite Element Methods, Computational Fluid Dynamics) to investigate cerebral blood flow (CBF), neurovascular coupling (NVC), and neurovascular system
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Eligibility criteria Numerical analysis and finite element method Solving anisotropic problems Website for additional job details https://emploi.cnrs.fr/Offres/CDD/UMR7340-SOPBAU-024/Default.aspx Work Location
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Post-Doctoral Associate in Sand Hazards and Opportunities for Resilience, Energy, and Sustainability
of the following areas: Large-deformation numerical modeling (e.g., Coupled Eulerian-Lagrangian (CEL), Material Point Method (MPM), or advanced Finite Element Methods). Physical modeling of tunnel
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transformations and also of finite element simulations of shape memory alloys. Physical experiments involve differential scanning calorimetry, thermomechanical testing, and potential nanoindentation of shape memory
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, electron microscopy, ultrasonic methods, optical spectroscopies, pump-probe techniques). - Proven experience in modeling planetary internal structure and dynamics, using thermodynamic, finite element, or
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mapping and imaging experiments to probe local heat transport and phonon dynamics; Perform finite element modeling (FEM) (e.g., using COMSOL Multiphysics) to simulate thermal transport processes and support
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jelly membrane through finite element analysis, in: Proceedings of SB2024. Compiégne, France. Da Rocha, A., Chatelin, S., Po, C., Laurent, C., Perroud, O., Kerdjoudj, H., Mauprivez, C., Baldit, A., 2025a
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of the fabricated fibers within optical networks. - Design of innovative hollow-core fiber structures using the finite element method. - Fabrication of specific optical fibers on a fiber drawing tower. - Linear
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using optical laser-based systems for device temperature and material thermal characterization, as well as developing material / device thermal models for device design using finite element and other