-
10-100 nm would be required, varying in absolute value over the surface of the wafer. An elegant method to correct wafer position is to include an adaptive element into the wafer stage, which allows
-
image analysis (segmentation, statistical feature extraction etc.) The project is part of a larger collaboration involving the Faculties of the University of Twente and a large industrial company
-
materials performance. Developing the understanding of the piezoelectric film structures and their functional properties using characterization techniques such as AFM, XRD, SEM and DBLI and detailed analysis
Searches related to finite element analysis
Enter an email to receive alerts for finite-element-analysis positions