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, chemistry, or related fields, or equivalent research experience. Candidates should demonstrate expertise in the following areas (not all mandatory, but strongly preferred): Electron beam lithography (EBL
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chain: growth of ferroelectric thin films and 2DEGs (PLD, sputtering), nanofabrication in a cleanroom environment (UV and/or e-beam lithography), and electrical characterization (transport and
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position primarily responsible for overseeing our new Raith Voyager 6 Electron Beam Lithography tool, purchased through the QCORE (Building Quantum Capacity, Operational Resilience and Equity: https
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position primarily responsible for overseeing our new Raith Voyager 6 Electron Beam Lithography tool, purchased through the QCORE (Building Quantum Capacity, Operational Resilience and Equity: https
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experience with nanofabrication processing (electron-beam lithography, maskless lithography, electron beam evaporation, dry etching, atomic layer deposition) • Background towards microsystems technology and
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comprehensive training in IEMN's cleanroom facilities. The cleanroom work will rely on process modules including molecular beam epitaxy (MBE), dielectric deposition (PECVD and/or sputtering), optical lithography
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Master Thesis in Physics or Materials Science: Remanent phase shifter based on memristive technology
techniques, including pulsed laser deposition (PLD), sputter deposition, electron-beam evaporation, optical lithography, and ion-beam etching. Characterization of individual layers using atomic force
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device fabrication techniques, including sputtering, evaporation, electron-beam lithography, optical and laser lithography, reactive-ion etching and plasma etching - Physical characterization techniques
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laboratory-scale fabrication processes required for state-of-the-art fabrication, including thin film deposition, electron microscopy, electron beam lithography, nanoimprint lithography, and reactive ion
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Helmholtz-Zentrum Dresden-Rossendorf - HZDR - Helmholtz Association | Dresden, Sachsen | Germany | about 1 month ago
-materials in various device architectures. This is accomplished in our fully equipped cleanroom and electron beam lithography facility. The department also provides low temperature (10 mK) and high-magnetic