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(electron-beam lithography, maskless lithography, electron beam evaporation, dry etching, atomic layer deposition) Background towards microsystems technology and/or semiconductor technology Experience with
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including e-beam and UV lithography, PVD, CVD, RIE/DRIE, wet etch, 3D microprinting, and metrology. Working Conditions Work performed primarily in a cleanroom environment. Frequent standing, walking, and
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processing (reactive ion etching, optical/electron beam lithography, scanning electron microscopy, atomic force microscopy, metal evaporation, wire bonding), performing computer-based simulations and modelling
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-On-Insulator (SOI) substrates. o Proficiency with key microfabrication techniques, including: • Photolithography and/or electron-beam lithography • Dry and wet etching (RIE, ICP, KOH, HF, etc.) • Thin film
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core capabilities include plasma processing, electron beam lithography, photolithography, thin film deposition, and metrology. The postholder will provide essential technical support to ensure the smooth
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meta-IOLs. Explore new horizons at the interface between polymer engineering and cleanroom nanofabrication (electron-beam lithography, reactive ion etching, atomic later deposition). MPQ cleanroom in
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. The successful candidate will characterize spin oscillators using high-speed/frequency electrical test stands and fabricate appropriate samples using electron beam lithography. Experience with electronic transport
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(PRTR). Where to apply Website https://jobs.icfo.eu/?detail=1056 Requirements Research FieldEngineering » Electronic engineeringEducation LevelMaster Degree or equivalent Research FieldEngineering
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piezoeléctricos/Sputtering of piezoelectric materials • Litografía óptica y por haz de electrones, metalización y ataque por plasma/Electron beam and optical lithographies, metallization, plasma etching
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on any of a set of broadly defined areas relevant to semiconductor manufacturing, including but not limited to: - Nanofabrication and patterning technologies, including EUV lithography, electron beam