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. The successful candidate will be joining the international QTWIST program that includes new joint laboratories of Prof. Jarillo-Herrero (MIT) and research groups of Prof. Adrian Bachtold, Prof. Carmen Rubio Verdú
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atomic-layer-by layer engineer-ing of novel artificial metastable materials and interface superconductivity; (iv) studies of superconducting heterostructures, Josephson junctions, SQUIDS, nanowires, and
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to) SIESTA (www.siesta-project.org) and its TranSIESTA functionality. SIESTA is a multi-purpose first-principles method and program, based on Density Functional Theory, which can be used to describe the atomic
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computers and, as a result, many of them remain poorly understood. UItracold atoms trapped in optical lattices provide a pristine realization of the Hubbard model and hold the promise of solving many of its
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Materials and Devices (AEMD) group focuses on the material sciences and technology aspects of novel electronic materials, with a strong emphasis on graphene as well as other 2D materials (MoS2). The group
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underlying human disease. The team brings together diverse expertise, ranging from work with mutant stem cell-derived beta cell organoids, engineered mouse models, single cell epigenomics, large-scale genetic
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applications. The candidate will help on MSc and PhD students supervision and training. AVAILABLE INSTRUMENTS Thermo Fisher Spectra 300 (60-300 keV), double corrected and monochromated, Gatan Continuum EELS with
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quantum memories, quantum light sources, quantum frequency conversion and quantum processing nodes. The current positions will be within a project aiming at developing quantum repeaters using solid-state
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materials. It is expected that the properties of the fabricated devices will be suitable for applications in electric vehicle integrated photovoltaics (VIPV). Transparent Photovoltaic Windows for the Electric
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quantum dot films engineered at the atomic as well as at the supra-nanocrystalline level to address applications related to safety and security, remote sensing, environmental monitoring, thermal imaging etc