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for Perovskite On-Chip Integration. ACS Nano, 2025. State-of-the-art electronic device fabrication techniques will be applied during the project, including thermal evaporation, magnetron sputtering, spin-coating
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. We take a bottom-up approach to robotics and develop soft materials and devices that would enable unusual form and unconventional functions for broader robotic applications. Job description Track 1
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Versatile Top-Down Patterning Technique for Perovskite On-Chip Integration. ACS Nano, 2025. State-of-the-art electronic device fabrication techniques will be applied during the project, including thermal
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capability of edge devices in buildings coupled with the complex interconnections and time varying dynamics. Addressing these challenges requires the development of the next generation of efficient data-driven
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running codes on HPC clusters). Knowledge of (or prior research) in robotics (e.g., ROS, forward/inverse kinematics), manufacturing (e.g., Additive or Subtractive Manufacturing), or computer vision/language