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Post Doctoral Researcher in Digital Twins CO2-to-Protein production in collaboration between the ...
collaboration between the Department of Electrical and Computer Engineering and the Novo Nordisk Foundation CO2 research center, Aarhus University, we aim to address this opportunity by developing digital twins
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staff. Design 3D structures in collaboration with research partners. Learn 3DIL instrument adaptation and improvement. Independently, you will use the 3DIL instrument to print biomedical active devices
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Job Description These days, the inner workings of molecules and materials can be probed and modelled by advanced simulation tools on modern computer architectures. However, the routine applications
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photovoltage in c-Se and device engineering ideas. Key tasks include: Improving and operating various equipment for making the solar cells (mainly via sputtering and evaporation). Using an array
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-small silicon nanocavities [Babar2023, Rosiek2023] with extreme light-matter interactions. We aim to combine fundamental theory, device design, and our unrivalled capabilities in high-resolution silicon
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or related fields. Preferably strong interest and foundation in immunology, immune cell assays, or translational research. Preferably experience with computer-guided protein engineering. Experience in human
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well-organized, self-motivated, result-oriented and capable of working independently in a collaborative setting You have strong analytical communication and computer skills Proficiency in spoken and
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generating unique three-photon quantum states that have the potential to become foundational building blocks for next-generation quantum technologies. You will join the “Fiber Optics, Devices, and Nonlinear
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offer a unique opportunity to contribute to high-impact research in drones, AI, and human-computer interaction. Successful candidates will join a dynamic and inspiring international research environment
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digital technologies within mathematics, data science, computer science, and computer engineering, including artificial intelligence (AI), machine learning, internet of things (IoT), chip design