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*************************************************************************** Application and Assessment Procedure Your application including all attachments must be in English and submitted electronically by clicking APPLY NOW below. Please include: Motivated letter of application (max
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industrial processes. Your research will drive a paradigm shift in how TES systems are modelled, integrated, and controlled within industrial settings. You will develop novel, adaptive, physics-informed models
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motivated candidate with a background in chemical or process engineering and strong experimental and analytical skills. Join us to drive innovation in carbon capture and contribute to shaping Europe’s low
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Job Description Do you want to contribute to a greener future where state-of-the-art scanning nitrogen vacancy (NV) magnetometry is introduced to visualize buried functional processes in energy
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website: https://healthsciences.ku.dk/phd/guidelines/ Application procedure Your application must be submitted electronically by clicking ‘Apply now’ below. The application must include the following
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-edge interdisciplinary project aims to understand charge transport in the natural mineral feldspar, unlocking new ways of measuring the rates of Earth surface processes — from weathering and erosion
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in catalysis Good language skills *************************************************************************** Application and Assessment Procedure Your application including all attachments must be in
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strong guidance from academic supervisors as well as from industrial experts. Responsibilities and qualifications Polishing is one of the last steps of the manufacturing process chain for industrial tools
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computer programming language is expected. You must have a two-year master's degree (120 ECTS points) or a similar degree with an academic level equivalent to a two-year master's degree. Approval and
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-high-resolution lithographic processes: You will explore and refine unconventional electron-beam resists (e.g., HSQ, metal fluorides, alkali halides) to reliably achieve robust pitches below 15 nm