Sort by
Refine Your Search
-
Listed
-
Employer
-
Field
-
thermal conductivity b) Development of hBN thermal interface material that combines a high degree of compressibility and recovery c) Modeling, simulation and characterization of phonon transfer across
-
experimental and computational tools, and are currently recruiting for the following roles: Position 1: AI and data science approaches applied to genomics and spatial omics Position 2: Experimental islet and
Searches related to current modeling
Enter an email to receive alerts for current-modeling positions