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Posted on Mon, 11/10/2025 - 09:42 Important Info Faculty Sponsor First name: Brian Faculty Sponsor Last Name: Hie Stanford Departments and Centers: Chemical Engineering Postdoc Appointment Term: A
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- Architectural Design IV ARC486 - Architectural Design V (Capstone - BS Arch Eng Technology) CON361- Government, Building, Environmental, Codes & Regulations Go to Courses (farmingdale.edu) for specific course
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Università degli Studi di Roma Tor Vergata - Dipartimento di Ingegneria Elettronica | Italy | 18 days ago
20 Jan 2026 Job Information Organisation/Company Università degli Studi di Roma Tor Vergata - Dipartimento di Ingegneria Elettronica Research Field Engineering Researcher Profile Recognised
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curriculum. Follow current course outlines, objectives, and evaluation mechanisms for the program and/or develop such when indicated by the President. Maintain a lesson plan of daily instructional events
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students work and study in this innovative environment. Click here to go to the website of the Faculty of Electrical Engineering, Mathematics and Computer Science. Conditions of employment Doctoral
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) the development of translational strategies in circuit neuroscience and (4) the development of computational models and methods for neuroscience. The goal is to implement advanced brain-on-chip models and CRISPR
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NYS Department of Labor apprenticeship program for stationary engineers or for plant maintenance (plumber/steamfitter), HVAC Mechanic or plant maintenance (refrigeration/AC); Or 7. Completion of a high
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hydrologic and hydraulic models (e.g., WRF-Hydro, HEC-RAS, OpenFOAM, GSSHA, Delft3D, EFDC, etc.). Data Engineering & Computational Workflows – 35% Curate, preprocess, and analyze large environmental datasets
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of solidification science and metal casting are of particular interest and thus are strongly encouraged to apply. Detailed Position Information The Department of Metallurgical and Materials Engineering (MTE: https
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new therapeutic avenues for tissue engineering, regenerative medicine and inflammation disorders. This inflammation on a chip device is expected to become an essential model for studying immune cells in