45 computational-physics-superconductor Postdoctoral positions at Stony Brook University
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Postdoctoral Associate Required Qualifications: (as evidenced by an attached resume) PhD (or foreign equivalent) in Biomedical Engineering, Medical Physics, Electrical, Computer Engineering or a
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Postdoctoral Associate Required Qualifications: (as evidenced by an attached resume) Ph.D. (or foreign equivalent) in Electrical Engineering, Computer Science, Applied Mathematics, or a closely
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, such as Psychology, Cognitive Science, Neuroscience, Biomedical Engineering, Computer Science, Psychiatry, Radiology, and Neurology, or General Medicine. Preferred Qualifications: Prior research experience
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Postdoctoral Associate Required Qualifications: (as evidenced by an attached resume) Doctoral Degree (foreign equivalent degree) in Experimental Nuclear or Particle Physics or closely related
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. Participation in professional advocacy activities. Qualifications Required Qualifications: Possession of a Doctorate in Psychology from a program accredited by the American Psychological Association (APA
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motivated candidates for postdoctoral fellow related to chronic kidney disease. Our research program focuses on identifying mechanisms involved in the progression of chronic kidney disease. Specifically, we
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Job Description Required Qualifications: (as evidenced by an attached resume) Ph.D. (or foreign equivalent) in Electrical Engineering, Computer Science, Applied Mathematics, or a closely related field
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Job Description Required Qualifications: (as evidenced by an attached resume) Doctoral Degree (or foreign equivalent) in Computer Sciences, Engineering, Neuroscience, Psychology or a closely related
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Postdoctoral Associate Required Qualifications: (as evidenced by an attached resume) Doctoral Degree (or foreign equivalent) in Computer Sciences, Engineering, Neuroscience, Psychology or a closely
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Computer Engineering or a closely related field, completed by the start date of the appointment. Research experience in at least one of the following areas: ● Chip design, tape-out, and testing