14 component-labeling-agorithm-cuda Postdoctoral positions at Northeastern University in United States
Sort by
Refine Your Search
-
programming skills and concepts Experience with fundamental OS and storage concepts. Experience with programming heterogenous architecture. Preferred Qualifications: Experience with CUDA programming; Experience
-
years subject to satisfactory performance and availability of funds. These positions will be in Professor Hai-Ping Cheng research group as part of Northeastern's broad Quantum Materials and Sensing
-
are separate from the natural world – upon an increasingly dominant paradigm in environmental science – social ecological systems, which acknowledges that human social systems are part of natural ecosystems
-
of simulation tools (e.g., Multiphysics finite element analysis, Matlab, Labview etc.) cleanroom experience, and characterization of electronic devices are required. Further, knowledge of system level integration
-
independently and as part of a collaborative team in a multidisciplinary environment. Strong organizational, record-keeping, and verbal and written communication skills. PREFERRED QUALIFICATIONS Experience with
-
to detail · Proactive, and able to work collaboratively as part of a dynamic, diverse, and growing team Application Materials If interested in the position, please provide a CV, contact of three references
-
able to manage and analyze large datasets; have strong organizational, written, and oral communication skills; and be able to work both independently and as part of a collaborative team. The initial
-
of optical microresonators and silicon photonics components, such as waveguides, gratings, power splitters, multiplexers, and demultiplexers. The research project will focus on developing an innovative
-
development. Candidates may be eligible for hire as part-time lecturers for the 2026 summer terms on a per-course basis. Responsibilities: Postdoctoral Teaching Associates teach 3 courses per semester in First
-
. Demonstrated experience in the heterogeneous integration of micro-scale devices and components (optical, electrical, and mechanical). Proficiency/familiarity with biocompatible packaging of implantable medical