Sort by
Refine Your Search
-
wireless network, IoT, etc. Applicants are invited to contact Dr Xianjin Xia at telephone number 2766 7273 or via email at xianjin.xia@polyu.edu.hk for further information. Conditions of Service A highly
-
project - “The structural evolution of the Chinese aviation network during and after the pandemic: a machine learning-based approach”. He/she will be required to: (a) be responsible for the collection
-
The appointees will assist the project leader in the research project – “Research on enhancement on high precision positioning network capability”. Qualifications Applicants for the Postdoctoral Fellow post should
-
- “Modelling welfare-enhancing airline cooperation at multi-airport systems - empirical and computational network analysis”. He/she will be required to: (a) conduct high-quality research in the field
-
project - “Sensing in 6G cellular networks”. Qualifications Applicants should have a doctoral degree or an equivalent qualification and must have no more than five years of post-qualification experience
-
mining, epistemic network analysis and cluster analysis. Experience in managing and analyzing large datasets, and the use of generative AI tools for research purposes are relevant strengths. The appointee
-
assist the project leader in the research project - “Enabling bulk data transfers for Low-Power Wide-Area Networks”. He/She will be required to: (a) develop innovative solutions to improve
-
highly complex workflows. We aim to develop optimization models and algorithms to improve wafer processing sequences across semiconductor manufacturing tools, with the objectives of reducing cycle times
-
] Duties The appointees will assist the project leader in the research project - “Joint research centre for design and net-shape forming of micro-/meso-scaled surface functional structures”. Qualifications
-
wafers are processed across hundreds or even thousands of manufacturing tools following highly complex workflows. We aim to develop optimization models and algorithms to improve wafer processing sequences