15 communication Fellowship positions at Hong Kong Polytechnic University in Hong Kong
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English Language (at least Grade C if Syllabus A; Level 2 if results are obtained from 2007 onwards), Chinese Language (Level 2 if results are obtained from 2007 onwards) and Mathematics; or a combination of results
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research and assist in project coordination for visually impaired guidance. For the Research Associate posts, the appointees will be required to involve for the post-training large language models
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collaboratively in a multidisciplinary research environment; and (e) be a good team player with excellent interpersonal and communication skills. Applicants are invited to contact Prof. Allen M. Y. Cheong via
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to communicate with the U3DP for collaboration; and (c) sound knowledge of and solid experience in 3D printing technology, including the related software and drawing tools, printing materials and various
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machine learning methods, particularly large language models (LLMs), to marketing research. Applicants are invited to contact Prof. Edward Lai at telephone number 2766 7141 or via email at edward-yh.lai
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conducting design research; (c) have a good command of written and spoken English; (d) have good communication and interpersonal skills; and (e) be able to work independently as well as in a team
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to collaborative projects; (d) excellent problem-solving skills and the ability to work in a fast-paced research environment; and (e) strong communication skills with excellent command of both spoken and
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the research projects - “Monitoring and predicting slope instability in forested terrain from multi-mode remote sensing data” and “Resilience of rural infrastructure and communities to climate change
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communications”. Qualifications For the post of Postdoctoral Fellow, applicants should have a doctoral degree or an equivalent qualification and must have no more than five years of post-qualification experience
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(Full-time/Part-time) [Appointment period: each for twelve months] Duties The appointees will assist the project leader in the research project - “Advanced photonics packaging for optical communications