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optimization of manufacturing & Design processes to improve 3DHI yield, performance, & reliability across a wide range of customer heterogenous materials and micro-systems. Work closely with circuit/layout
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industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility. Design and execute experiments for packaging performance optimization
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measurement methods. Essential to the role is collaboration with engineers and technicians across TIE to anticipate and address their design and development needs, assist in process and tool optimization, and
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accounting standards and public company reporting methodologies into clear guidance for non-finance stakeholders. Process Improvement & Systems Optimization Map existing workflows to pinpoint inefficiencies