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the field of electronics design, in particular CMOS circuit design. The position offers a large international network in an industrially-relevant field, and possibilities for close cooperation with
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input and output interfaces for 28 nm CMOS microelectronic technology. Functions to be developed: Perform digital design, synthesis, placement and routing, as well as signoff, tapeout and verification
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candidates with excellent academic and research records, and at least 3 years of post-PhD research experience, in the following areas: Advanced CMOS Devices (memory, RF) Photonics & Lasers (on-chip sources
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tool for plant health inspectors during import controls. Further information can be found here: https://cordis.europa.eu/project/id/101181582 Flexible Working We will consider applications for employment
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management skills. Strong interpersonal and mentoring skills. Advocate for safety and ethics in the workplace. Preferred: Experience with integrated CMOS circuit design, verification, and tapeout in standard
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Inria, the French national research institute for the digital sciences | Paris 15, le de France | France | 28 days ago
the Inria-AIO team (https://team.inria.fr/aio/ ) and will receive their PhD from Sorbonne University. The Inria-Paris center is located at the heart of Paris, in the 13th arrondissement. Some details of
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Inria, the French national research institute for the digital sciences | Paris 15, le de France | France | 28 days ago
scholar will be working in the Inria-AIO team (https://team.inria.fr/aio/ ) at the Paris center, in the heart of the city in the 13th arrondissement. The GAIA project aims to design electronics for a
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Open Date for Applications: November 10th, 2025 Closing Date for Applications: December 1st, 2025, 23h00m (Lisbon Time) Key words: #mixed-signalanalogICdesign #CMOS #EDAtools #Neuromorphic
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lithography, and directed self-assembly - Advanced semiconductor materials processing (e.g., epitaxy, atomic layer deposition, and chemical vapor deposition) - Device and process integration for CMOS, beyond
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chemical vapor deposition) - Device and process integration for CMOS, beyond-CMOS, and heterogeneous systems - 3D heterogeneous integration and advanced packaging. - Metrology and characterization