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Applicants should go to https://www.nottingham.ac.uk/bbdtp/apply/how-to-apply.aspx Enquiries should be sent to: bbdtp@nottingham.ac.uk Please quote ref: BBSRC DTP APPLICATION Closing date: 11:59pm 11 August
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HPC systems. IVRs either in package or on-chip, provide voltage regulation closer to the load, enabling miniaturization and modularity while reducing resistive losses due to shorter PDN interconnects
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Gene expression modulation CRISPR/Cas9 (including knock-out, knock-in, CRISPRa, CRISPRi, viral vector systems) Next-generation sequencing (RNA-, ATAC-, ChIP-Seq, CUT&RUN, Hi-C and others) Pulldown and
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Applicants should go to www.nottingham.ac.uk/bbdtp/apply/how-to-apply.aspx Enquiries should be sent to: bbdtp@nottingham.ac.uk Please quote ref: BBSRC DTP APPLICATION Closing date: 11:59pm 11th August 2025
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/ slot die coating. The screen-printing process is scientifically complex; a non-Newtonian multi-phase elastic material (containing conducting/semi-conducting particles, organic binder and solvent) is
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. These are essential components for optical quantum computers and quantum networks, where one bit of information is encoded in the quantum state of a single photon. You will be part of a team of 10-12 people between
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, residency (living in the UK for at least three years and not wholly for educational purposes) or other connection to the UK. “Best practices for minimising dross formation during melting of scrap aluminium
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partner Tata Steel UK. The project aims to advance fundamental knowledge on the impact of residual elements inherited from steel scrap on slag performance and utilisation in the scrap-based electric arc
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and performance in HPC systems. IVRs either in package or on-chip, provide voltage regulation closer to the load, enabling miniaturization and modularity while reducing resistive losses due to shorter
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–pollutant interactions, organoids-on-a-chip, and decellularized ECM (dECM), while LMCD specializes in biocompatible hydrogel design and characterization. Novel hydrogels will be developed from dECM, modified