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Postdoctoral Appointee - Investigation of Electrocatalytic Interfaces with Advanced X-ray Microscopy
part of the DOE–BES initiative Integrated Scientific Agentic AI for Catalysis (ISAAC) , a multi-facility collaboration integrating experimental modalities and simulations to enable an orchestrating
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facilities in Argonne National Laboratory, including the Advanced Photon Source and the Center for Nanoscale Materials, and integrates expertise in ultrafast optics, accelerator physics, and condensed-matter
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Argonne National Laboratory seeks a Postdoctoral Appointee to perform computational research on materials for thermal and electrochemical interfaces. The successful candidate will integrate first
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validation datasets Integrate surrogate models into workflows to predict bias-driven structural and electronic evolution Design and execute high-throughput calculations; build and manage curated materials
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/vegetation drag parameterizations. E3SM integration and coupling. Integrate two-way land–river–ocean couplings with a subgrid scale ocean model to support upstream river boundary conditions and coastal
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Flexibility to engage across multiple projects, research topics, and applications Ability to model Argonne’s core values of impact, safety, respect, integrity, and teamwork Ability to maintain a full-time, on
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operando experiments under electrical, thermal, or mechanical bias to capture real-time defect dynamics. Integrate multimodal datasets and collaborate with AI/ML teams for data fusion, physics-informed model
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. Working within an interdisciplinary team, you will develop frameworks that connect atomistic features, mesoscale dynamics, and device-level performance. The effort will integrate heterogeneous data from
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Python and either PyTorch or TensorFlow is required Experience using High-Performance Computers (HPCs) is preferred Ability to model Argonne’s Core Values: Impact, Safety, Respect, Integrity, and Teamwork
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quantum transduction and terahertz (THz) photon generation via enhanced light–matter interactions. The postdoc will lead efforts in device patterning and the integration of complex materials—such as