12 analog-and-integrated-circuits Postdoctoral positions at Chalmers University of Technology in Sweden
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hold a doctoral degree in microwave electronics, semiconductor device physics, or RF circuit design awarded no more than three years prior to the application deadline*. A strong background in one or more
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We invite applications for several postdoctoral research positions in experimental quantum computing with superconducting circuits. You will work in the stimulating research environment
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finite element modeling as the foundation of a comprehensive design framework that integrates simulation, experimentation, and machine learning. Fall-related injuries are a leading cause of morbidity and
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comprehensive design framework that integrates simulation, experimentation, and machine learning. Fall-related injuries are a leading cause of morbidity and mortality in aging populations, making this work a
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of deployments Integrate research outcomes into proof-of-concept demonstrators and perform performance assessments in representative environments Collaborate with team members and external researchers from
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employees from over 30 countries. The department is a fully integrated department with Chalmers University of Technology and University of Gothenburg as principals. The position is placed in the Division
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Computer Science and Engineering is strongly international, with approximately 300 employees from over 30 countries. The department is a fully integrated department with Chalmers University of Technology and
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. The position may also include a very small amount of informal supervision of bachelor or master students. It is expected that your research will be integrated within the currently established research
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expected that your research will be integrated within the currently established research collaborations and that you will take an active role within the collaborations as regards pushing new research ideas
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you will do Conduct independent research in collaboration with the research group Customize microfluidic platforms by integrating biological barriers and tissue-mimicking materials into chip designs