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characterization data. Design and execute development plans, including DOE setup, in-line characterization strategy, pilot line follow-up, and data analysis. Module Robustness & Scalability: Apply industry
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) fabs. You make sure that Silicon Interposer, Trough Silicon Vias, Die to Wafer and Wafer to wafer process modules can be matured enough to be integrated into our manufacturing services (prototyping and
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, to strengthen the performance, stability and reliability. Work with customer collaboration to setup established technology node processes at customer sites, expanding the width of the semiconductor industry. Be
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& Scalability: Integrate industry-standard BKM practices to enhance performance and reliability across programs. Collaboration & Communication: Work closely with imec’s FEOL and BEOL Integration teams. Share
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goal is to research manufacturable solutions for novel high-speed opto-electronic devices, either to achieve ultra-low power (<1pJ/bit) consumption for compute and ultra-short reach applications
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to internal and external partners. We identify trade-offs in emerging integration flows and establish device-process correlations. Your goal is to research manufacturable solutions for novel high-speed opto
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seamless integration of components and subsystems within the demonstrator platform. Stay ahead of industry trends and contribute to imec’s thought leadership through publications and partner engagements
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projects and perform characterization and failure analysis of materials used. Monitor industry trends and innovations, apply scientific knowledge and adapt to imec research programs and activities. Interface
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from you. Join us in pushing the boundaries of AI, collaborating with industry leaders, and helping to develop the next generation of computational drug discovery tools. What you will do You will be
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research institutions, industry leaders, and technology hubs. Spot opportunities: Engage with potential candidates for the imec.istart program. Recognize potentially interesting partnerships and