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- Maastricht University (UM); Maastricht
- Maastricht University (UM); 26 Sep ’25 published
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) for terabyte-scale 3D histology images, from preprocessing to analysis and validation. Handle and visualize large 3D microscopy datasets. Image optically cleared and labelled samples with 3D microscopy methods
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-analysis pipelines (statistics, mathematical modeling, and ML) for terabyte-scale 3D histology images, from preprocessing to analysis and validation. Handle and visualize large 3D microscopy datasets. Image
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microswimmers/microrobots that can move and interact autonomously in 3D environments, mimicking the complex dynamics of microorganisms in fluids. Living systems such as bacteria or algae exhibit remarkable
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the English Language. More information can be found here . Preferred but not required: Experience with behavioral data analysis, 3D tracking, or video analysis Familiarity with comparative methods, phylogenetic analyses
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, microfabrication, 3D-printing, finite element analysis, atomic force microscopy (AFM), microfluidics, optical microscopy, electron (cryo) microscopy, image analyis, statistical data analyis, and biophysics. You are
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in environmental analysis, reducing exposure and aiding site assessments. The Sensor Engineering group at Maastricht University's Faculty of Science and Engineering focuses on innovative sensor
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for rapid PFAS identification in environmental analysis, reducing exposure and aiding site assessments. The Sensor Engineering group at Maastricht University's Faculty of Science and Engineering focuses
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. Preferably, you have experience in one or more of the following fields: scientific instrumentation, microfabrication, 3D-printing, finite element analysis, atomic force microscopy (AFM), microfluidics, optical
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), ecological processes (primary productivity and decomposition rates), and greenhouse gases (3D-printed flux chambers), and investigating how we can use citizen science-driven data streams for model development
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Raman systems. Demonstrated hands-on experience with rapid prototyping (PCB design, laser cutting, 3D printing) and middleware development to interconnect measurement systems. Experience integrating