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time is to be minimized by developing a robot ensemble for parallelized polishing as well as surface roughness and shape characterization. The »3D Sensors« group contributes to this goal by developing a
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Secihti call and go through a parallel application process. Please see the respective Secihti call here for further information on their selection process. The aim of the scholarship programme is to
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, parallel processing and hardware-oriented applications and optimisations as well as operating systems. The project will be carried out in close cooperation with Audi in Ingolstadt and Neckarsulm, aiming
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systems with more than two energy levels (qudits) Scaling compilation approaches to utilize the processing power of parallel systems/supercomputers To learn more about our previous work, please check out