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its competitive edges in technology, health and society. We are looking for Postdoctoral Research Fellows in the field of Advanced Microelectronics Packaging. The full-time position will be filled for a
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functions to work properly. Please turn on JavaScript in your browser and try again. UiO/Anders Lien 1st March 2026 Languages English English English PhD Research Fellow in Neuromorphic Microelectronics Apply
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-research-fellow-in-neuromorphic-microelectronics Where to apply Website https://www.jobbnorge.no/en/available-jobs/job/294530/phd-research-fellow-in-ne… Requirements Research FieldComputer scienceEducation
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will develop and carry out on-wafer metrology. Qualifications - A PhD degree in Materials Science Engineering, or a related field. - 2 years of relevant experience with microelectronic fabrication
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years of relevant experience with microelectronic fabrication. ? Familiarity with programming in MATLAB and Python. ? Experience with finite element simulations in ANSYS or COMSOL. ? Strong oral and
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with fabrication techniques such as flexible substrates, and microelectronics. Familiarity with sensor integration and characterization methods, including for health monitoring/ wearable robotics
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substrates, and microelectronics. Familiarity with sensor integration and characterization methods, including for health monitoring/ wearable robotics applications. Ability to work independently and as part of
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improve the performance, reliability, and thermal management in microelectronics packages and wide bandgap power electronics. The researcher will work closely with NIST experts in optics, thermal metrology
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with fabrication techniques such as flexible substrates, and microelectronics. Familiarity with sensor integration and characterization methods, including for health monitoring/ wearable robotics
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/ Microelectronics/ EEE/ or related. Hands-on semiconductor process development in cleanroom (Cu interconnect/wafer or hybrid bonding; litho/etch/CMP/plasma/anneal). Characterization: optical/profilometry, SEM/TEM