Sort by
Refine Your Search
-
to microelectronic devices and low-power, three-dimensional, non-von Neumann computing architectures. You will utilize ORNL’s unique ultra-high-vacuum, glovebox, and ambient atomic force microscopy capabilities
-
-Performance Computing (HPC), scientific Artificial Intelligence (AI), and scientific edge computing. We are a leader in computational and computer science, with signature strengths in high-performance computing
-
Requisition Id 15682 Overview: We are seeking a highly motivated Postdoctoral Research Associate to contribute to the NEUROPIX project, an interdisciplinary effort at the intersection of high-energy
-
a unique opportunity to develop cutting-edge high-performance computing (HPC) that incorporate machine learning/artificial intelligence (ML/AI) techniques into visualizations, enhancing the efficiency
-
Sciences Directorate, at Oak Ridge National Laboratory (ORNL). This position presents a unique opportunity to develop cutting-edge high-performance computing (HPC) and machine learning/artificial
-
to contribute to development of alloys with desirable advances in mechanical properties, thermal/electrical properties, and processability. A background in solidification processing, high pressure die casting
-
transformative solutions to compelling problems in energy and security. We are seeking a Postdoctoral Research Associate to perform experimental studies on chirality driven quantum states. This position resides in
-
crystal material’s growth and characterization. You will perform cutting-edge research on theory and modeling of dynamics in condensed matter. Major Duties/Responsibilities: Development of theoretical
-
in high-performance computing and data analytics with applications in a large variety of science domains and NCCS is home to some of the fastest supercomputers and storage systems in the world
-
for additive manufacturing (AM). The candidate will aid staff in conducting high quality research by developing, integrating, and deploying advanced sensing modalities (e.g., thermal, optical, acoustic, etc