55 electrical-engineering-lund Postdoctoral positions at Oak Ridge National Laboratory
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reside in the Materials Joining Group in the Materials Analysis and Interface Science Section, Materials Science and Technology Division, Physical Sciences Directorate, at Oak Ridge National Laboratory
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, and measure success. Basic Qualifications: A Ph.D. in Polymer Chemistry, Organic Chemistry, Polymer Science and Engineering, Chemical Engineering, Materials Science and Engineering, or a closely related
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& Interface Science Section of the Materials Science and Technology Division (MSTD), Physical Sciences Directorate at Oak Ridge National Laboratory (ORNL). As part of our research team, you will collaborate
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will involve designing beam dynamics experiments, measurement, simulation, and data analysis. This position resides in the Accelerator Physics Group in the Accelerator Science and Technology Section
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Requisition Id 16167 Overview: The Multiphysics Modeling and Flows (MMF) Group in the Computational Sciences and Engineering Division is seeking a Postdoctoral Research Associate with expertise in
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respectful workplace – in how we treat one another, work together, and measure success. Basic Qualifications: A PhD in mechanical engineering, industrial engineering, electrical engineering, environmental
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treat one another, work together, and measure success. Basic Qualifications: A PhD degree in material science, mechanical engineering, electrical engineering, robotics, or a related field completed within
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technology by helping to attract, develop, and retain the workforce of actinide scientists to meet the needs of the nation. Topic of Interest This position is supported by the Department of Energy Isotope
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Requisition Id 16217 Overview: The Multiscale Biomedical Systems Group within the Advanced Computing in Health (ACH) section of the Computational Sciences and Engineering Division (CSED) at Oak
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production target materials. This involves the development of experimental plans to examine material properties such as thermal diffusivity, thermal conductivity, and thermal expansion – material properties